ARE YOUR PRODUCTS TOO BIG AND HEAVY?

Everyone wants smaller and lighter products, and a significant factor in determining a product's overall size and weight is the heat sink. In pursuit of this goal, Enovus Labs has developed Segri-COOL, a lightweight and compact cooling solution.

To date, we have designed thermo-mechanical solutions for some of the solar system’s most extreme environments. From these extremes, Segri-COOL was born.

The adjacent image shows the massive difference between a Segri-COOL heatsink (bottom) and a comparable diecast heatsink (top).

Two heatsinks MWC2

THE THERMAL CHALLENGE

Thermal crosstalk, the transfer of heat between PCB components on a common heat sink, can cause components with higher temperature tolerance to be overcooled. This inefficiency necessitates larger and heavier heat sinks than required. Segri-COOL segregates and controls the flow of heat from the components to the fins, eliminating overcooling, and resulting in a more efficient, smaller, and lighter heat sink.

To illustrate, we have subjected a basic board containing two components with varying power levels and temperature tolerance to an environment with a temperature of 55°C, very typical of problems found in many industries.

TRADITIONAL COOLING SOLUTION

In this image, a traditional die-cast heat sink is designed to provide cooling for all board components. Component 1 receives excessive cooling to ensure that component 2 remains within its operational temperature range. However, this excessive cooling necessitates a larger and heavier heat sink than what is strictly necessary. The specific heat sink shown weighs 2.8 kg and occupies a volume of 2.8 liters.

Segri-COOL SOLUTION

With our patented Segri-COOL heat sink, we can efficiently cool all board components within their respective operating limits. The result is a significantly smaller and lighter heat sink, and therefore smaller and lighter product. The Segri-COOL heat sink shown weighs just 0.77 kg and occupies a volume of 1.5 liters, making it 70% lighter and 45% smaller than the die cast solution.

GET IN TOUCH TO DISCOVER HOW Segri-COOL CAN REDUCE THE SIZE AND WEIGHT OF YOUR PRODUCTS

REDUCE TOTAL COST OF OWNERSHIP WITH Segri-COOL

The telecommunications industry grapples with a considerable challenge: keeping products cool within a compact and lightweight design. While Radio Access Network (RAN) hardware equipment costs represent approximately 5% of the Total Cost of Ownership for Communication Service Providers (CSPs), site construction, installation, and rental constitute approximately 35%, with each aspect significantly influenced by hardware size and weight.

Segri-COOL, being smaller and lighter, has the potential to reduce installation, transport, construction, and OpEx costs for the operator.

Segri-COOL IS EASILY TAILORABLE

Segri-COOL is an incredibly versatile technology applicable across various industrial sectors, ranging from industrial LED cooling to space deployments. If you're facing a cooling challenge and need a compact and lightweight solution, contact us to see how Segri-COOL will work for you.

Segri-COOL ON THE ANALOG DEVICES STAND AT MOBILE WORLD CONGRESS.